A flip chip, also known as controlled collapse chip connection, is a method to interconnect semiconductor devices to an external circuitry. This technique involves the deposition of bumps on chip pads on the top side of the wafer. It is then flipped over and aligned with its respective matching pads on the external circuit with the solder reflowed to complete the interconnect.
The flip chip market has witnessed a significant rise since the development of copper pillar and micro-bumping metallurgy. Furthermore, the benefits that these chips offer as compared to the conventional wire bonding method, is encouraging the expansion of the market.
According to AllTheResearch, “The flip chip market size was USD 25.26 billion in 2019 and expected to reach USD 43.65 billion by 2027; this converts into a compound annual growth rate (CAGR) of 7.08% for the forecast period.”
Flip chip Market dynamics:
The development in the IoT sector coupled with the rising demand for portable electronics have created an upsurge in the demand for flip chips. Moreover, a higher I/O capability, superior thermal & electrical performance and more are making this technology more popular among various organizations. The widening application base is further boosting the market growth.
Flip chips are comparatively expensive than its counterpart – wire bonding. Also, this technology does not permit customization/modifications after it is manufactured. The high cost and fewer customization options could restrict overall market growth.
However, the growing requirements for high-frequency microwave, ultrasonic frequency operations and high-speed portable devices are anticipated to provide lucrative opportunities for the flip chip market.
The development of the industry’s first 12-layer 3D TSV technology, by Samsung Electronics Co. Ltd. in July 2019, will feature faster speed and lower power consumption as compared to the wire bonding technology.
In December 2020, Intel announced the discontinuation of part numbers using leaded solder bumps on the 1st level interconnect for a few fields programmable gate arrays (FPGA) flip chip product families.
Flip chip Market segmentation and geographic breakdown:
The 2.5D IC held over 35% of the flip chip market in 2019. This dominance can be attributed to its benefits over the 2D IC packaging technology. However, the 2.5D IC technology is expected to be replaced by the 3D IC packaging technology. Reduced interconnect length, faster operation, heterogenous integration, improved microelectronics cooling and more are rendering the 3D IC segment the fastest growing one during the forecast years. The segment is estimated to witness a CAGR of around 8%.
The copper pillar technology, owing to its ability to enable better joint diameter control and reduced stand-off height, accounted for under 55% of the market in 2019. On the other hand, the gold bumping segment is predicted to register an approximate 9% CAGR between 2020 and 2027. The high growth rate can be attributed to its extensive use in various electronic devices.
The IT & telecommunication segment is projected to expand at 10% CAGR throughout the forecast period. Nevertheless, in 2019, the electronics segment led the flip chip market, securing nearly 50% i.e., under USD 12 billion in revenues.
The North American market is characterized by the presence of well-established players, increasing investments in advanced technologies especially in IoT and the demand for high performance electronics. Asia-Pacific, on the contrary, will grow on account of rapid industrialization, high demand for IC components and a flourishing electronics sector.
A few key players include, but not limited to: 3m, Advanced Micro Devices, Inc., Amkor Technology, Apple Inc., Fujitsu Limited, Intel Corporation, International Business Machines Corporation, Samsung Electronics Co., Ltd., Taiwan Semiconductor Manufacturing Company Limited, Texas Instruments Incorporated.
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